Connecting leaders within the semiconductor eco-system
2 June 2020, ISES Webinar
8 September 2020, ISES Webinar
1-2 December 2020, Hsinchu, Taiwan
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URGENT TSES UPDATE
In light of the recent outbreak of the Novel Coronavirus infection in Wuhan, Hubei Province China, which has now been declared a global health emergency by the World Health Organisation (WHO), management have come to the unfortunate decision to postpone Taiwan Semiconductor Executive Summit.
The safety of our members and the community in the region is all too important and we wish not to jeopardise this. Unfortunately, the virus is affecting everyone globally. Travel restrictions have been placed for our international and regional partners. To maintain the integrity of the event and your wellbeing, postponement of the event while the outbreak is contained is regretfully the best decision.
Our thoughts are with those affected and safety should be everyone’s priority.
In the meantime, our team is here to support you in any matters. We hope this issue is resolved as quickly and efficiently as possible and look forward to seeing you at the event.
We regret for any inconvenience this has caused you.
Safe regards,
Taiwan Semiconductor Executive Summit
Our Sponsors
Benefiting you, your company and the industry
Being the world’s largest gathering of senior executives in semiconductor manufacturing, we can offer you many exclusive benefits.
Global Network
Meet government officials and senior semiconductor manufacturers from around the world who are seeking new solutions.
Expand Business
Identify opportunities to partner in markets where budget for semiconductor manufacturing is being ring-fenced
Forecast Growth
Learn what the primary market and government are planning for the future of semiconductor manufacturing.
Access Funding
For OSAT / Foundry / IDM / IC Design / AI / 5G / Automotive Companies:
At the Summit
Limited to the top decision-makers and influencers in the industry. Benefit from the following:
Includes 20 hours of:
Plus countless hours dedicated to help you develop your professional network
Available Facilities
Themes & Topics
Networking Opportunities
SPEAKERS
Advisory Board Members
Sponsorship Benefits
Being the world’s largest gathering of senior executives in semiconductor manufacturing, we can offer you many exclusive benefits.
Private Meetings with Senior Decision Makers
The one-to-one business meetings are pre-arranged and mutually agreed. This provides a supplier with the best opportunity for productive, solution-oriented and well-structured business meetings.
Improved Profit and Loss Balance Sheet
This is the ultimate unique reason why suppliers attending the Taiwan International Semiconductor Executive Summit: accelerate the sales cycle by meeting your potential and existing customers from around the world in one location over 2 days.
Partnered with the Best Research Companies in the World
The Taiwan Semiconductor Executive Summit is partnered with leading semiconductor manufacturers, whom have provided the industry with new research, technology to create the market by having the opportunity to influence decision makers in their technology strategy. The result is a faster return on R&D and the prospect of being a preferred supplier.
Cement Your Relationship with Existing and Potential Customers
Semiconductor Manufacturing Business Intelegence
Sponsorship Packages
- Silver Networking
- 5 / 7 / 10 x Pre-arranged face to face executive business meetings
- 1 VIP pass – Including full hospitality:
– Full-day Executive Hospitality passes
– Coffee and cocktail networking passes
– Gala dinner invitations
– Presentation, workshop and keynote passes - Prior and Post contact
- Personal account manager
- Event branding
- Delegate profiles
- Event prospectus
- Gold Meeting Package
- 5 / 7 / 10 x Pre-arranged face to face executive business meetings
- 2 VIP passes – Including full hospitality:
– Full-day Executive Hospitality passes
– Coffee and cocktail networking passes
– Gala dinner invitations
– Presentation, workshop and keynote passes - Prior and Post contact
- Personal account manager
- Event branding
- Delegate profiles
- Event prospectus
- Workshop Package
- Strategic supplier presentation or interactive workshop
- 2 VIP passes – Including full hospitality:
– Full-day Executive Hospitality passes
– Coffee and cocktail networking passes
– Gala dinner invitations
– Presentation, workshop and keynote passes - Prior and Post contact
- Personal account manager
- Event branding
- Delegate profiles
- Event prospectus
There are various marketing and sponsorship branding opportunities at the Taiwan Semiconductor Executive Summit:
For equipment / materials / software suppliers:
Contact
About
We are leaders in connecting leaders in the semiconductor industry.
Taiwan Semiconductor Executive Summit – is an elite and exclusive invitation only conference amongst leading semiconductor manufacturers, equipment & material suppliers and research institutes. TSES focuses on a high-level executive community model and is attended by industry thought leaders who are at the forefront in driving technological advancements in a rapidly innovative and changing industry.
The semiconductor industry will continue to drive innovations and TSES provides an unparalleled platform that enhances semiconductor manufacturing by driving innovation, business and investment opportunities across the whole microelectronics supply chain. Through our proven sister platform, China International Semiconductor Executive Summit, we have developed a trusted network of prominent executives and companies’ in the semiconductor industry. Through this and at the request of our partners in Taiwan, we strive to deliver a platform that recognises and promotes the greatly established Taiwanese semiconductor industry.
We carefully profile all delegates pre-registration to ensure an audience of exclusive members. Our delegates will be able to intensify these discussions of the challenges and opportunities in the semiconductor market. Our delegates, tasked with identifying solutions to enhance the technological roadmaps for key growth markets in 5G, AI, HPC, Automotive and Memory applications welcome our mission to promote focussed collaborative discussions in an intimate environment where topics of mutual interest can be developed at a decision making level.
TSES places you front of mind and provides valuable mediums for companies’ to present solutions and services to the established domestic and international supply chain to meet your marketing objectives. Our experience in the last decade has positioned us as the most powerful networking gathering that enhances Research & Development, Manufacturing and Business Development opportunities to the next level.
Bio coming soon…
Wang Yu-Po received Ph.D. in Mechanical Engineering from State University of New York at Binghamton, U.S.A
He received his M.S degrees in Electrical Engineering from Tsinghua University, Taiwan. He has spent more than 20 years in semiconductor industry. Starting professional career from R&D at UMC gave him sold knowledge in wafer manufacturing. Technical Marketing let him connect wafer manufacturing and product application jointly. Gradually involving sales to handle business and expatriated to UMC Europe to manage key costumer. Completely training to make him realize wafer business and supply chain. After worked for UMC, he had 1-year experience in EDA vendor, Synopsys. This experience helped him go trough design flow of IC chips. Then he joined CSMC, Wuxi, response for marketing and sales. China local industry helped him to build strong connection and customer relationship with China semiconductor industry. Combine wafer manufacturing, chip design flow and marketing and sales, which makes him him knowledgeable in semiconductor industry.
Dr. Marvin Liao / 廖德堆博士
Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.
