Connecting leaders within the semiconductor eco-system

Bio coming soon…

Wang Yu-Po received Ph.D. in Mechanical Engineering from State University of New York at Binghamton, U.S.A

In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore. He has jointed SPIL since 1998 and led the R&D advanced packaging design team for leadframe, substrate and wafer form packages development.

Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development. He has 83 patents in US.

Experience:

• 1997-1998 Gintic Institute of Manufacturing Technology, Singapore
• 1998-Present SPIL, Taiwan

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Terms & Conditions

1. Scope of Agreement

• These are the conditions of the contract between you, the Client (“You” and “your”) and Taiwan Semiconductor Executive Summit (“TSES”, “we”, “us” and “our”) governing your use of our services, including event attendance as set out in your booking form. This agreement constitutes the entire agreement between TSES and you. All prior agreements understandings and negotiations and representations (save for fraudulent misrepresentation) whether oral or in writing are cancelled in their entirety. The terms of any other electronic communications will not form part of this agreement.

2. Our Commitment To You

• We will provide you with a planned schedule prior to the Event. Please note that this schedule may be altered where necessary by us.
• We reserve the right to determine the theme, scope and content of seminars and presentations to be held during the Event and to vary the programme and / or its contents as deemed necessary.
• Should the event be cancelled or the location be changed for reasons or circumstances beyond our control we reserve the right to reschedule the Event, including changing the location, and / or withdrawing delegates attendance upon written notice to you. If your attendance is withdrawn by us you will receive a full refund of your registration fee.

3. Delegates

• Only named or pre-agreed delegates may attend the Event. Non–appearance of any of the Delegates will not affect your obligation to pay in accordance with the terms set out below (5). No persons other than those officially registered or agreed with us may attend any part of the Event.
• Delegates must adhere to the deadlines set out by the Operations Manager. Deadlines will be communicated once we have received your delegate contract confirmation. This includes returning your catalogue entry form, delegate photograph and your prioritised meeting request choices.
• Delegates must attend all prescheduled Event meetings and the seminar programme.
• Delegates are responsible for their own insurance (including, but not limited to, travel insurance, personal effects and personal insurance), vaccinations and visas (where applicable).

4. Flights / Hotel – Airport Transfers / Accommodation

• Delegates are responsible for their own flight, transfer arrangements and accommodation and the costs associated with them.

5. Payment

• The total fees specified on the Agreement are subject to an additional service charge of 7.5% (“Service Charge”) applied to cover administration costs, and are exclusive of VAT and any other applicable sales tax which shall be payable in addition.
• Payment must be received in full within 28 days from the date of this agreement.
• The applicable VAT rate will be charged in addition to the Total Cost.
• Contracts received within 28 days of the start of the event must be paid by return.

6. Cancellation

• Cancellations received more than twelve weeks prior to the Event commencement date will be entitled to a full refund of the registration fee paid.
• If you cancel your registration less than twelve weeks before the Event commencement date you will incur a charge of £1,500 (less any registration fee, as specified on this registration form, that you may have already paid which will not be refunded).
• Cancellation fees can be avoided by providing replacement delegates from your organisation. You will be liable for any additional cost incurred as a result of supplying replacement delegates. We reserve the right to refuse replacement delegates.
• All cancellations must be received in writing and agreed by us, and full cancellation fees must be paid within 14 days.

7. General

• You the delegate, your executive/s or your agents may not transfer or assign any of the rights or obligations of this Agreement (in whole or part) without our prior consent. Any attempt to resell, assign or transfer rights without our consent will entitle us to cancel the contract without liability to you.
• TSES is subject to the UK Data Protection Act 1998 and is registered in the UK with the Information Commissioner t o process your personal information. Our primary goal in collecting personal information from you is to give you an enjoyable customised experience whilst allowing us to provide services and features that most likely meet your needs. We collect certain personal information from you, which you give to us when using our Sites and/or registering or subscribing for our products and services. We also collect certain personal data from other group companies to whom you have given information through their websites. If you do not want us to continue using this information please notify us at enquiries@ioctr.com. Any personal information supplied to TSES as part of this registration process and/or any other interaction with TSES will be collected, stored and used by TSES, its subsidiaries, related companies or affiliates in accordance with the TSES Privacy Policy. Please email enquiries@ioctr.com for a copy of the TSES Privacy Policy.
• This agreement is governed by and will be construed in accordance with English law and each party irrevocably agrees that the courts of England will have the non-exclusive jurisdiction to deal with any disputes arising out of or in connection with this agreement.
• The working language of the Event is English. Delegates requiring an interpretation service must make their own arrangements at their own expense.

He received his M.S degrees in Electrical Engineering from Tsinghua University, Taiwan. He has spent more than 20 years in semiconductor industry. Starting professional career from R&D at UMC gave him sold knowledge in wafer manufacturing. Technical Marketing let him connect wafer manufacturing and product application jointly. Gradually involving sales to handle business and expatriated to UMC Europe to manage key costumer. Completely training to make him realize wafer business and supply chain. After worked for UMC, he had 1-year experience in EDA vendor, Synopsys. This experience helped him go trough design flow of IC chips. Then he joined CSMC, Wuxi, response for marketing and sales. China local industry helped him to build strong connection and customer relationship with China semiconductor industry. Combine wafer manufacturing, chip design flow and marketing and sales, which makes him him knowledgeable in semiconductor industry.

Dr. Marvin Liao / 廖德堆博士

Vice President / 副總經理

APTS / 先進封裝技術暨服務

tsmc / 台灣積體電路製造股份有限公司

Education

• Ph.D. Materials Science, University of Texas at Arlington, USA, 1989
• Bachelor Materials Science, Tsing Hua University, Taiwan, 1979

Experience 

• tsmc Advanced Packaging Technology and Service, 2011 – now
• tsmc Special Project, 2009 – 2010
• tsmc Fab 6 Director, 2003 – 2009
• Chartered Semiconductor, Singapore, 1997 – 2002
• Applied Materials, USA, 1994 – 1997
• SGS Thomson Microelectronics (STM), USA, 1990 – 1994

Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.

Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.

Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>

And as a big basketball fan and food connoisseur, Ron welcomes the opportunity to enjoy a good meal after a great game.

Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.

Prior to EVG, he held several management positions at Amdahl Deutschland GmbH (Amdahl Germany Ltd.), including most recently as director of professional services for Central Europe, and country manager for Switzerland and Austria. In this role, he oversaw an organization of 120 employees and provided consulting services to the IT industry. Before that, Waltl served as both a project manager and sales manager at Nixdorf Computer GmbH/Siemens Nixdorf Information Systems in Salzburg, Austria.

Waltl received a master of business administration degree, with an emphasis on business economics and strategic corporate management, from the University of Innsbruck, Austria.

Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.

Julio spends his personal time with his children and volunteering in youth enrichment programs such as Assistant Scout Master for Boy Scouts of America, and coaching youth ice hockey.

Previously Julio served as Regional Sales Manager at SUSS MicroTec, Strategic Account Manager for DCG Systems, and Sales and Applications Manager at Schlumberger Automated Test Equipment. Prior to Julio’s entry into the semiconductor industry, Julio served in the U.S. Navy as a Naval Flight Officer, patrolling the skies in the P-3, Orion, Submarine Hunter aircraft.

Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.

Mr. Morales is an accomplished program vice president, manager, and industry expert with over 25 years of experience in building a multinational top-tier consulting, sales, and research team and driving a set of established businesses. Solid experience in managing strategic partnerships and advisory services with IDC’s largest multinational clients. Strong analytical, strategic planning skills, and managing complex projects involving strong collaboration across geographies, functional groups, and business units. Proven leadership skills and instrumental at establishing research and business KPIs.

Mr. Morales is a trusted advisor to leading high tech company executives, financial investors, and bankers on market landscape and direction, product and technology positioning, competitive benchmarking, M&A, HW, and SW technology, and brand health and sustainability. Established relationships with technology suppliers including Intel, Samsung, TSMC, Qualcomm, Huawei, HP, AMD, NVIDIA, Microsoft, Facebook, TI, Micron, IBM, GE software, SoftBank, ARM, NXP, and others.

Mr. Morales is the leading advisor and expert analyst for IDC’s largest Wall Street clients including investment banking, VC’s, and mutual and hedge funds across every major financial region.

Over his career, Mr. Morales has authored and co-authored over 240 reports and studies in the area of semiconductors, mobile, PC, wireless, embedded, IoT, and IT marketplace. His team is responsible for some of the most interesting and evolving tech in our industry including coverage of microprocessors, accelerated computing, storage and memory,sensors and connectivity. His team has been responsible for initiating coverage of emerging technologies for IDC, and driving new research business practices, and creating leading industry market models in DRAM, NAND, Embedded processors and controllers, accelerated computing architectures, cellular baseband modems, WLAN, WiMAX, cellular broadband, digital consumer, foundry, EMS, intelligent systems, and overall semiconductors.

His career includes past postions with NEC Electronics and Dataquest.

EDUCATIONAL ACCOMPLISHMENTS

• B.S. in Finance and Accounting from San Jose State University
• Fluent in English and Spanish
• Frequent presenter and advisor to CEOs and executive teams across his portfolio of clients
• Strong reputation as an advisor and industry expert on Wall Street
• IDC executive analyst for Intel and Qualcomm
• Frequent speaker, presenter, and moderator at IDC Directions events in Asia and semiconductor industy conferences including ISS, GSA, CASPA, and SEMI