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General Manager of Taiwan Branch, National Instruments
Jimmy Lin currently serves as general manager for NI Taiwan. In his 18 years career with NI, he experienced various engineering, sales, and managing his team to serve semiconductor, electronics manufacturing, and academia customers. He holds master degree of material science and engineering from National Chiao-Tung University, bachelor degree from National Taiwan University, and three LED process related patents (USA/Taiwan).
Title: The Future of Semi Test – Applying Digital Transformation Technologies to Semiconductor Product Development
Digital transformation is going apply not only to IT organizations, e-commerce systems, or storage data in the cloud but also to many technologies that improve our experiences how semiconductor organizations design, test, and manufacture semiconductor products. In this presentation, we’ll share some of the latest trends and technologies that best-in-class semiconductor companies are using to accelerate and improve product designs. More specifically, we’ll share practical examples of how companies are utilizing technologies ranging from the remote automation to the cloud to artificial intelligence to transform modern engineering labs and enterprises.
Senior Director of Engineering, Qualcomm
Ehsanul Islam is a senior director of engineering at Qualcomm and responsible for Taiwan & SEA customer engineering teams including HW, SW and Technical account managers.
Prior to joining Qualcomm in 2013, Ehsanul Islam worked in executive level positions for PacketVideo (a sister company of NTT DoCoMo) and Vodafone Japan with a strong history in program management, defining and managing product roadmaps for multimedia software and mobile platform for high end smartphones. Since 2009, He served as a managing director of PacketVideo India with responsibility for building up the high-quality engineering team for new multimedia software development including product definition and rollouts as well as strategic customer engagement and alignment.
Ehsanul Islam has also held application engineering positions at Motorola/Freescale semiconductor, and Agilent Technologies, focused largely on wireless communications. He holds a bachelor & master`s in electronics engineering from the Tokyo University of Electro-communications and MBA in international business from the Tsukuba University, Japan.
Title: The 5G Future
Qualcomm is leading the world to 5G. We are designing a unified, more capable 5G platform by inventing many new technologies to meet 5G’s expanded and radically diverse connectivity requirements. We are driving 5G NR from standardization to commercialization, contributing to 3GPP standards.
From 2019, 5G moved from a buzzword to a reality as 5G-enabled smartphones began to hit the market and carriers started offering 5G services. That’s just the beginning. It will be a platform for innovation in ways we cannot yet imagine. What’s next for 5G and key enabling technologies that will enhance the 5G experience moving forward?
Head of Semiconductor Business Unit, Evatec
Silvan Wuethrich gained his bachelor degree in micro and nanotechnology at NTB, Buchs, Switzerland specialising in the field of oxide and nitride layers for optical interference coatings for his thesis. After holding various management positions within Evatec he took over as Head of Business Unit “ Semiconductor” in April 2018 with overall responsibilty for Evatec’s activities across Power Device, MEMS and Wireless Technology Markets
Title: Clever machines – getting the most from the Fab
Semiconductor production sites no longer need human intervention to manage every aspect of their production. Today, an increasing number of industrial processes are supported by automation, artificial intelligence (AI) and other upcoming technologies like the IoT that enable organizations to get more out their production lines.
Clever predictive maintenance technology is an effective way to avoid potential failures and costly production loss. The final outcome is less downtime, less money spent on repairs, and less human effort in managing all of these maintenance and service processes. The newest generation of Evatec PVD systems address such future requirements of semiconductor fabs driving down production costs.
Ruurd Boomsma received a Master Degree in Technical Physics from the State University of Groningen, the Netherlands, in Semiconductor Physics and High Vacuum Technology. He started working in the equipment part of the semiconductor industry in 1984 at ASM in Bilthoven, the Netherlands, in front end equipment including Epi, Diffusion, PECVD Implant and Litho and was also involved in the sales of the first steppers from ASML (at that time part of ASM). Then he moved on to MRC, a USA based company for PVD and Etch equipment. Later he became responsible for the Unaxis (Oerlikon) Materials and Display Divisions. He is now over 10 years active at Besi. Initially involved in technology assessment, supply chain optimization followed by holding the responsibility for the Plating Product group and later full responsibility for the Die Attach product group. He is now Besi’s Chief Technology Officer and also responsible for strategic supply chain management and overall quality.
Title: Advanced Packaging Technologies for next generation devices
The drive towards faster response semiconductor devices requiring lower power consumption and yielding higher overall performance coupled with smaller features is continuing and even accelerating, enabling new applications like 5G, AI, Cloud Computing and Autonomous Driving. New packaging technologies like 2.5D, 3D, SIP and Chiplets are becoming a key enabler now. In addition, the upcoming 5G technologies also require new packaging technologies
This presentation will highlight some of the latest technical developments and limitations on placement and bonding technologies for Flip Chip, TCB and direct Cu to Cu Bonding on Die Level. New levels of accuracy, placement speeds and cleanliness are key factors for such processes. Also we will highlight SIP and advanced molding for 5G and other devices.
At last we will also review some of newest developments in advanced packaging for power devices driven by car electrification as well as demands for more energy efficient power conversion
Senior AVP Technical Marketing, Win Semi
Title: Compound Semi. in Wireless Communication: Opportunities & Challenges
With the advent of the post-5G era, there is still a lack of the discussions about the requirements for post-5G specification, feature and technology. Currently, what we can expect is that the specifications of frequency and linearity will be a challenge for semiconductor technology.
Due to excellent physical properties, compound semiconductors have been widely used in communication and other related applications. In this talk, we will propose the evolution of roadmap and trends from the perspective of technologies and applications. Moreover, we will try to explore the opportunities and challenges for future communications as well.
Assistant General Manager, Toshiba Electronic Components Taiwan Corporation
Dr. Hitoshi Mizunuma is an Associate General Manger of System Device and Digital Marketing Department of Sales Management & Semiconductor Division at Toshiba Electronics Components Taiwan Corporation, serving as a marketing engineer in charge of mixed signal ICs, logic LSIs, and discrete products of AIoT, IIoT, and IoV edge device application fields for more than 20 years in Taiwan. He earned both bachelor and master degrees in mechanical engineering at Tokyo Institute of Technology, and earned a Ph.D. degree in computer science and information technology at National Taiwan University.
Title: Re-inventing MCUs: from Micro-Control Unit to Motor-Control Unit
There are only two silicon choices in the market for FOC (Field-of-Control) inverter system design: (i) faster ARM Cortex core to execute all algorithm by software, or (ii) hard-wired logic to optimize the design metric at the expense of poor flexibility and upgradability. Toshiba proposes the 3rd way “Vector Engine” integrated MCUs to find the best trade-off between two options, introducing the industry-first turnkey solution of not only MCUs but also Power MOSFETs, photo-isolators and development tools required for various high-wattage motor applications.
Senior Solution Architect, Leader of NVIDIA AI Technology Center – Taiwan, Nvidia
2018-now senior solution architect, leader of NVAITC-TW (NVIDIA AI Technology Center – Taiwan)
2016-2018 principle engineer of YEP (Yield Excellence Program) in TSMC
2012-2016 assistant professor of EE department of Chang Gung University (CGU).
2010-2011 Post-doc in Graduate Institute of Photonics and Optoelectronics(GIPO) of National Taiwan University (NTU)
He received the B.S degree in Physics in 2003, and the PhD degree in 2010 from GIPO, both from NTU.
His research and scientific interests include deep learning and machine learning algorithm development, Medical or Industrial imaging system, like Optical Coherence Tomography/Microscopy, ultrasound, MRI, CT etc.
Title: NVIDIA Deep Learning Relevant Creativity in EDA fields
Deep Learning revolutionizes many fields like medical, autonomous, manufacturing, finance, electronic design automation (EDA) etc. In this talk, we will give you a briefing about deep learning and select two deep learning innovations related EDA field including (A) Graph Convolutional Network in Testability Analysis and (B) DREAMPlace.
Vice President Advanced Packaging Development, Micron
Dr. Akshay Singh is Vice President of Advanced Packaging Technology Development at Micron. He joined Micron in 2006. He leads a global team that is responsible for delivering advanced memory packaging solutions for compute, storage, mobile and embedded markets. Prior to joining Micron, Akshay worked at a startup developing actuators and sensors based on novel electroactive polymers. Akshay holds master and doctoral degrees in mechanical engineering from Louisiana State University in US and bachelor degree in mechanical engineering from Maharaja Sayajirao University in India.
Title: Accelerating Innovation with memory and storage solutions
Data is the currency of the new Data Economy driving value creation not imagined only a few years ago. With unprecedented data explosion, Memory and storage solutions are becoming key to unlocking finance insights and powering health care, transportation and communication. Innovation in compute architectures, silicon solutions and heterogeneous integration will be at the center of this transformation.
VP VP of Technology R&D Group, Winbond
1981 B.S. National Taiwan University, EECS
1987 Ph.D., UC, Berkeley, EECS
1987-1989 Intel Corp. Sr Process Engineer
1989-1990 Cypress Semiconductor Corp. Engineering Manager
1991-1993 Knights Technology, VP, Engineering
1993-1995 Omega Micro Inc. VP, Engineering
1995-1999 Vanguard International Semiconductor Corporation, Director of Marketing
2000-2003 Ascend Semiconductor Corp. Founder and President
2003-2012 Nanya Technology Corporation, VP, Global Sales and Marketing
2012-2014 FocalTech Systems, VP, Marketing BG
2014- Winbond Electronics Corp. VP, Technology R&D Group
Title: Taiwan Memory Industry’s Future: Hidden Champion
In this presentation, we will review the limitation of Taiwan’s memory industries, for both DRAM and Flash. The Fundamental issues are lagging technologies, which make the typical memory companies’ strategies not working. However, if we utilize the advantages from our strength, more dynamic industries with smaller scale, there are opportunities for us to thrive to prosperity. The path is generally described as the Hidden Champion.
The Hidden Champion approach requires the company to excel in the selected industry segments with leading advantages, from technologies, business strategies, or customer service. These advantages will only come from consciously building up through the years until some entry barriers are established.
In addition, the Hidden Champion also typically survey the global market to expand into unique market segments where its unique strength delivers unfair advantages for the companies. Also the Hidden Champion is best utilizing the global resources especially talents.
Regional Vice President and Taiwan Managing Director, STMicroelectronics’ Asia Pacific Region.
Izzo joined SGS-Thomson Microelectronics (now STMicroelectronics) in 1987 and shortly thereafter relocated to Asia, living and working in many different Countries, from Korea to Taiwan, to Hong Kong to China. He has held various positions within ST’s Asia Pacific organization, covering marketing, application development and product design for power management, consumer and computer systems, automotive, and multi-segment products. Izzo established ST’s Automotive and Multi-Systems Competence Centers in Shanghai and Power Management Competence Center in Taiwan, contributing to the Company’s success in in many areas of the business developments in Asia Pacific, while leading the expansion of the operations in Taiwan.
Starting 1991, Izzo has been working in Taiwan where he has intermittently lived for more than 20 years. He is married with a Taiwanese lady, with two children.
For the year 2013 and 2014, Izzo served as the Chairman of the European Chamber of Commerce Taiwan (ECCT). In the Years 2015, 2016, 2017, 2018, Izzo served as the Vice Chairman of ECCT. In year 2019 and 2020 Izzo has been elected again Chairman of the ECCT.
Other activities include:
In January 2019 Izzo was conferred the Taiwanese Citizenship, for Special Merits.
Giuseppe Izzo was born in Caserta, Italy, in 1958 and graduated with a degree in Electronic Engineering from the University of Naples, Italy.
*POLITO: Polytechnic of Torino (Italy), SCUT: South China University of Technologies in Guangzhou
President, Andes Technology
President Lin started his career being as application engineer in United Microelectronics Corporation (UMC) while UMC was an IDM with its own chip products, he experienced engineering, product planning, sales, and marketing jobs with various product lines in UMC. In 1995, after four years working on CPU chip product line as business director, he was transferred to UMC-Europe branch office to be its GM when UMC reshaped to do wafer foundry service, he lead UMC-Europe to migrate itself from selling IDM products to selling wafer foundry service.
In 1998, after 14 years working in UMC, President Lin switched job to work in Faraday Technology Corporation (Faraday), he lead ASIC business development as starting, then on-and-off leading ASIC implementation, chip backend service, IP business development, industry relationship development (IR), as well as Faraday’s spokesperson, in 2004, he started to lead the CPU project spin off operation of Faraday. President Lin became co-founder of Andes Technology Corporation (Andes) in 2005 when it was found up, he formally took position to be Andes’ President since 2006.
President Lin received BSEE degree of Electrophysics from the National Chiao-Tung University, Taiwan, and MSEE degree of Electrical and Computer Engineering from Portland State University, Oregon, USA. Under his management, Andes has been recognized as one of leading suppliers of embedded CPU IP in semiconductor industry. Andes also won the reputation of leading technology company with awards such like 2012 EE Times worldwide Silicon 60 Hot Startups to Watch, 2015 the Deloitte Technology Fast 500 Asia Pacific award, etc.
In 2015, President Lin received accolade award of Outstanding Technology Management Performance, Taiwan, for his contribution to the high-tech industry.
Title: From Edge to Cloud: RISC-V with DSP, Vector and Custom Instructions for AI
Edge and Cloud Computing are in the corner, getting popular, yet their implementation are emerging and new designs are on the way to production. In this presentation, Andes RISC-V Cores with extensibility and modularity allowing designers to use RISC-V cores and eco-system for all of the workloads will be introduced. Andes AI customers adopt RISC-V Cores with applications from edge to cloud. An overview regarding how to leverage the RISC-V DSP extension for low-data volume workloads like voice and face recognition with low power will be presented. For high data throughput applications, we will introduce the industry-first commercial RISC-V Vector Processor solution and how it can be used to speed up compute-intensive applications. Then, how to leverage RISC-V’s strength to allow custom instruction extensions by leveraging Andes Custom Extension (ACE) will be introduced.
ams AG, VP, Head of Innovation Office
Markus Rossi has a master degree in physics and a PhD in micro-optics. He was co-founder of the company Heptagon which developed into a major supplier for micro-optical solutions in mobile phones and smartphones. Heptagon was acquired by ams early 2017 where Markus has built up an interdisciplinary team for 3D system solutions. He is now head of the Innovation Office of ams AG.
Title: VCSEL Innovations for 3D Sensing Applications & Technologies
Amkor, President Taiwan
Master of Science – Microelectronic Engineering, Arizona State University
Deputy Director/ MediaTek
Sr. Engineer/Via Technology
Title: Emerging Chiplet Package Technologies
Development of Chiplet package technologies from the IC design house point of view
Director & Principal Analyst, Packaging, Assembly, Substrates & Semiconductor Manufacturing, Yole Development
Santosh Kumar is currently working as Director & Principal Analyst at Yole Développement. He is involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. His main interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-out / fan-in WLP, flip chip, and 3D/2.5D packaging. He received the bachelor and master’s degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.
Title: Future of Fan-out WLP/PLP business: Myth vs Reality
Fan-out packaging is not new, and it has been adopted in mobile devices for more than 10 years. However, it has attracted lot of attention since 2015, when Apple adopted TSMC’s InFO technology for iphone A10 application processor (AP). It was speculated, other key fabless players will soon adopt InFO or other high-density fan-out technology for flagship mobile AP by replacing laminate substrate-based flip-chip PoP. But it has not happened, even though already qualified by various fabless players. What are the reasons? Do we see other players adopt high density fan-out for mobile AP in near future? After a steady growth, we recently saw the decline in the low-density fan-out (eWLB type) business. What is the current status and prospect? TSMC is clearly emerged as the winner in the high-density fan-out with multiple design offerings. Is there any challenge to them from other OSATs /foundries/IDMs? What is the status of fan-out at other manufacturers? Fan-out PLP has also generated lots of interest and many players are working on it including tool/materials suppliers. Samsung /SEMCO started FO-PLP HVM with Galaxy watch AP. Will Samsung adopt FO-PLP for flagship phone AP? What is the FO-PLP status at other manufacturers (OSATS/IDMs)? Will the FO PLP business significantly increase in the coming years as ASE and PTI increase capex by bringing additional PLP capacity online? This presentation will try to answer these questions and overview the overall activity happening in fan-out WLP/PLP ecosystem.
GLOBALFOUNDRIES, Vice President, Mobility and Wireless Infrastructure (MWI) Business Unit
Peter Rabbeni joined GLOBALFOUNDRIES in October 2012 and brings over 30 years of design/development, field applications engineering, technical sales, business development and marketing experience in the area of RF systems, circuits and technologies. Mr. Rabbeni is currently the Vice President of Business Line Management for the Mobility and Wireless infrastructure Business Unit at GLOBALFOUNDRIES and is responsible for all business line P&L activities associated with the wireless infrastructure and SATCOM markets.
Peter helped support M&A activity that culminated in the GF acquisition of IBM Microelectronics Specialty Foundry business in 2015. Prior to joining GF, Peter served as WW Business Development Program Director for IBM Microelectronics Specialty Foundry business from 2010 to 2012, where he helped focus the division’s 200mm foundry offerings in capturing silicon content in mobile handset front end modules and created one of the most successful and profitable design-win periods in the divisions history resulting in more than $3B in long-term revenue and to date shipping over 50B RFSOI-based products for smartphone and WiFi front ends. He joined IBM in 2001 and held various leadership roles in foundry sales, field applications engineering and marketing before heading up the business development and strategy responsibility for the microelectronics foundry business unit. Prior to IBM, Peter held various RF systems and circuit design engineering positions at Ericsson, Raytheon and the U.S. Army Millimeter Wave Lab. Peter received his BSEE degree from the Stevens Institute of Technology in 1986 and an MSEE from the University of Massachusetts in 1991. He is an alumnus of the IBM Executive Management program and the Executive Program for Growing Companies at Stanford University.
Peter has co-authored several papers and published a number of trade journal articles and blogs and speaks regularly on the trends and developments in the mobile wireless technology space at conferences and consortiums across the world. Mr. Rabbeni is a member of the IEEE.
Title: 5G Rising: Technology Choice for Network Differentiation
5G deployments are rapidly being executed across major markets across the world. The use cases and applications aim to drive new applications and business models and potentially add $2T+ to the global economy over the next 15 years. With this benefit comes system complexity that requires careful optimization in its implementation. Coverage and reliability have always been key factors in operator profitability. In fact, the choice of technology used to implement these systems has a direct bearing on not only the customer experience but also operator investment over the life of the network. This presentation will explore the technical and financial tradeoffs on how the choice of specialized silicon solutions can potentially redefine 5G network customer experience and economics.
SVP Design Verification, GUC
Chiang Fu is Senior Vice President of Global Unichip Corp. He joined GUC from 2008 as Product, Package design and testing develop director for 40nm and 28nm ASIC production. In 2015, He is also in charge of GUC SOC RD for 12nm and 7nm SOC spec-in design and verification. He has published 3 conference papers as corresponding author and granted 5 patents in USA , Taiwan and China. He is also the member of the SEMI Taiwan package &Testing committee since 2015.
His previous positions include the department manager of 8 and 12 inches yield and process engineering, TSMC(1993-2008).
Program Vice President, IDC
Mario Morales is the program vice president of IDC’s enabling technologies, storage, and semiconductor research. He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and consumer.
Mr. Morales is an accomplished program vice president, manager, and industry expert with over 25 years of experience in building a multinational top-tier consulting, sales, and research team and driving a set of established businesses. Solid experience in managing strategic partnerships and advisory services with IDC’s largest multinational clients. Strong analytical, strategic planning skills, and managing complex projects involving strong collaboration across geographies, functional groups, and business units. Proven leadership skills and instrumental at establishing research and business KPIs.
Mr. Morales is a trusted advisor to leading high tech company executives, financial investors, and bankers on market landscape and direction, product and technology positioning, competitive benchmarking, M&A, HW, and SW technology, and brand health and sustainability. Established relationships with technology suppliers including Intel, Samsung, TSMC, Qualcomm, Huawei, HP, AMD, NVIDIA, Microsoft, Facebook, TI, Micron, IBM, GE software, SoftBank, ARM, NXP, and others.
Mr. Morales is the leading advisor and expert analyst for IDC’s largest Wall Street clients including investment banking, VC’s, and mutual and hedge funds across every major financial region.
Over his career, Mr. Morales has authored and co-authored over 240 reports and studies in the area of semiconductors, mobile, PC, wireless, embedded, IoT, and IT marketplace. His team is responsible for some of the most interesting and evolving tech in our industry including coverage of microprocessors, accelerated computing, storage and memory,sensors and connectivity. His team has been responsible for initiating coverage of emerging technologies for IDC, and driving new research business practices, and creating leading industry market models in DRAM, NAND, Embedded processors and controllers, accelerated computing architectures, cellular baseband modems, WLAN, WiMAX, cellular broadband, digital consumer, foundry, EMS, intelligent systems, and overall semiconductors.
His career includes past postions with NEC Electronics and Dataquest.
Business Development Manager, Scientech Corporation
Bio coming soon…
Managing Director of Advanced Packaging, Applied Materials
Experienced in all facets of the technology sector, Vincent has over 30 years of outstanding achievement in Technology Development, Operations, Business, Sales and Marketing, having demonstrated success at companies like IBM, Amkor, ASE, TSMC, and GLOBALFOUNDRIES.
Currently leading Corporate and Business Development for the Advanced Packaging division at Applied Materials, he is responsible for forging new strategic alliances and partnerships key to technology advancement for future product solutions. As Applied Material’s Strategic Advisor to the CEO of Tango Systems, Vincent guides this joint development effort executing multi-faceted global Go-To-Market strategies focused on addressing key technology and market inflections for new interconnect platforms.
With a degree in Pure and Applied sciences at Champlain Regional College, and a Bachelor of Engineering degree from Concordia University, Vincent is both the author and co-author of 30 Patents in the field of advanced semiconductor packaging.
For more information please visit: linkedin.com/in/vincentdicaprio
President, Episil Technologies Inc.
He received his M.S degrees in Electrical Engineering from Tsinghua University, Taiwan. He has spent more than 20 years in semiconductor industry. Starting professional career from R&D at UMC gave him sold knowledge in wafer manufacturing. Technical Marketing let him connect wafer manufacturing and product application jointly. Gradually involving sales to handle business and expatriated to UMC Europe to manage key costumer. Completely training to make him realize wafer business and supply chain. After worked for UMC, he had 1-year experience in EDA vendor, Synopsys. This experience helped him go trough design flow of IC chips. Then he joined CSMC, Wuxi, response for marketing and sales. China local industry helped him to build strong connection and customer relationship with China semiconductor industry. Combine wafer manufacturing, chip design flow and marketing and sales, which makes him him knowledgeable in semiconductor industry.
Commercial Director, Westerwood Global
Geoffrey joined Edwards back in 1984 and quickly became involved in the growing Semiconductor Market that Scotland enjoyed in the late 80’s. This exposure and learning led to opportunities to support Edwards equipment in the Far East, Geoffrey spent over 7 years in Asia living and working in Japan, Singapore, Taiwan and China.
Customers and Service have always been the focus of Geoffrey’s work in Edwards whether it was hands on in the early days to regional then global management and is now responsible for directing Edwards continued service growth as their Vice President Marketing – Semiconductor Service.
Managing Director & COO, AT&S India
Mr Sunil Banwari is the Chief Operating Officer and Managing Director of AT&S India Pvt. Ltd. He has 30 years of international leadership experience including 20 years in US and 10 years in Asia in semiconductor and electronics manufacturing supporting automotive, consumer, computing. Military/aerospace, communications, networking and industrial applications. He has delivered top results in positions of increasing responsibility at Fortune500 companies like Intel Corp (20 yrs) and ON Semiconductor (7yrs) and other midsize companies including Smiths Interconnect and Neotech EMS. He is a multi-lingual with English, Hindi, Japanese, and Spanish and beginner German/Mandarin. He enjoys a high profile in Asia technology sector and is board member of Industry associations in China, India and Philippines. MS/MBA.
R&D Senior Director, SPIL
Wang Yu-Po received Ph.D. in Mechanical Engineering from State University of New York at Binghamton, U.S.A
In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore. He has jointed SPIL since 1998 and led the R&D advanced packaging design team for leadframe, substrate and wafer form packages development.
Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development. He has 83 patents in US.
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Mustafa Pinarbasi is the CTO and Sr. Vice President of Magnetics Technology at Spin Memory (Previously Spin Transfer Technologies). Before joining Spin Memory in 2013, Dr. Pinarbasi was a CTO and SVP of Technology Development at SoloPower, Advanced Technology Department Manager at Hitachi GST and Distinguished Engineer at IBM. His accomplishments at IBM include the development of the giant magneto-resistance sensor used in the first GMR-based hard disk drives (HDD) and pioneering the adoption of ion beam sputtering technology into the read sensor production. He led the development of tunneling magneto-resistance (TMR) read head processing at Hitachi GST and the development of flexible and light weight solar panels at SoloPower. Dr. Pinarbasi holds a Ph.D. from the University of Illinois at Urbana-Champaign. He is an inventor with over 200 U.S. patents, has authored or co-authored over 30 scientific publications and has received numerous industry awards.
Mr. Ning Chen used to work in the mobile communication industry in Japan for long years. After joined Panasonic in 2003, he has been engaged in the development of advanced sensor solutions for smart systems. He is now the Director of China Technology Center of Industrial Solutions Company.
Ron, who joined CNW in early 2013 after over a decade at DHL, sees himself as customer-centric. He is available day and night to listen and help customers realize that CNW is their most reliable special logistics partner. Ron believes in open communications and making it easy for them to approach CNW with urgent and emergency shipping challenges, no matter how complicated.</span>
And as a big basketball fan and food connoisseur, Ron welcomes the opportunity to enjoy a good meal after a great game.
Hermann Waltl is currently the executive sales and customer support director for EV Group (EVG). In this role, he is responsible for overseeing EVG’s worldwide sales operations across all of the company’s product lines and key markets including Asia Pacific, Europe and North America. Waltl joined EV Group in 2002 as a sales operations manager where he was responsible for all aspects of worldwide contract management and sales administration for three years.
Prior to EVG, he held several management positions at Amdahl Deutschland GmbH (Amdahl Germany Ltd.), including most recently as director of professional services for Central Europe, and country manager for Switzerland and Austria. In this role, he oversaw an organization of 120 employees and provided consulting services to the IT industry. Before that, Waltl served as both a project manager and sales manager at Nixdorf Computer GmbH/Siemens Nixdorf Information Systems in Salzburg, Austria.
Waltl received a master of business administration degree, with an emphasis on business economics and strategic corporate management, from the University of Innsbruck, Austria.
Julio Coppo is currently serving the role of Vice President of Sales and Strategic Business Development for Nanotronics, a technology company that builds robotic, artificially intelligent industrial grade microscopes, including nSpec® and nSpec® 3D. nSpec®’s highly customizable software and hardware, enables these products to serve the semiconductor, material sciences, rubber, pharmaceutical and biotechnology industries. Julio joined Nanotronics in the Fall of 2016 and he oversees the global sales and customer outreach team.
Julio spends his personal time with his children and volunteering in youth enrichment programs such as Assistant Scout Master for Boy Scouts of America, and coaching youth ice hockey.
Previously Julio served as Regional Sales Manager at SUSS MicroTec, Strategic Account Manager for DCG Systems, and Sales and Applications Manager at Schlumberger Automated Test Equipment. Prior to Julio’s entry into the semiconductor industry, Julio served in the U.S. Navy as a Naval Flight Officer, patrolling the skies in the P-3, Orion, Submarine Hunter aircraft.